Related articles can be listed by using the tag links under each article.
News and Articles
This area lists current press releases from Die Devices together with technical articles and white papers.
Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.
Silicon Carbide (SiC) Bare Die MOSFETs & Schottky Diodes from GeneSiC deliver industry leading performance.
Tags:
Get part number quotes, check stock quantities and use our parametric search to specify your components.
SOI FET Gate Driver for Full-Bridge / H-Bridge & Motor Control applications enhances performance + reliability.
The Power MOSFET die range from Analog Power Inc. covers a broad spectrum of low & high voltage products.
Tags:
Defining SiP (System-In-Package) together with some considerations for easier design process.
Tags:
The advantages and disadvantages of using bare die to build hybrid circuits
The advantages and disadvantages of using bare die to build MCMs (Multiple-Chip-Modules)
Mechanical specification of a bare die and how a bare die can be modified to suit a specific application.
Tags:
Mechanical | SiP | MCM | Hybrid
The pros and cons of using bare die to build MCMs (Multiple-Chip-Modules)
Featured Product
EA2M
ON Semi Serial 2-Mb SPI Ultra Low-Power EEPROM with ECC for high reliability portable or battery applications.
News and Articles
High-Speed Die Processing/Sorting
Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.
