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News and Articles

This area lists current press releases from Die Devices together with technical articles and white papers.

Related articles can be listed by using the tag links under each article.

The Power MOSFET die range from Analog Power Inc. covers a broad spectrum of low & high voltage products.

Defining SiP (System-In-Package) together with some considerations for easier design process.

Tags:

SiP

The advantages and disadvantages of using bare die to build MCMs (Multiple-Chip-Modules)

Tags:

MCM | Ceramic

Mechanical specification of a bare die and how a bare die can be modified to suit a specific application.

Tags:

Mechanical | SiP | MCM | Hybrid

The pros and cons of using bare die to build MCMs (Multiple-Chip-Modules)

Tags:

MCM | Plastic

The Pros and Cons of using bare die to build SiP (System-In-Package)

Tags:

SiP

A range of former Fairchild branded Zener Bare Die Products were made obsolete due to commercial & operational re-alignment under new ownership. However, in response to customer and market needs we are providing continued support of these die via our franchised supplier, <a href="https://siliconsupplies.com" target="_blank" title="Silicon Supplies">Silicon Supplies (SiS)</a>. These Zener Bare Die from Silicon Supplies are electrically and mechanically identical, enabling continuation for customers already using these die in long term applications.

The paradox of buying bare die & five key considerations before purchase.