Innovate > Integrate > Empower - Design at Die Level

News and Articles

This area lists current press releases from Die Devices together with technical articles and white papers.

Related articles can be listed by using the tag links under each article.

Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.

Get part number quotes, check stock quantities and use our parametric search to specify your components.

Silicon Carbide (SiC) Bare Die MOSFETs & Schottky Diodes from GeneSiC deliver industry leading performance.

The Power MOSFET die range from Analog Power Inc. covers a broad spectrum of low & high voltage products.

Defining SiP (System-In-Package) together with some considerations for easier design process.



The advantages and disadvantages of using bare die to build MCMs (Multiple-Chip-Modules)


MCM | Ceramic

Mechanical specification of a bare die and how a bare die can be modified to suit a specific application.


Mechanical | SiP | MCM | Hybrid

The pros and cons of using bare die to build MCMs (Multiple-Chip-Modules)


MCM | Plastic