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News and Articles
This area lists current press releases from Die Devices together with technical articles and white papers.
Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.
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Silicon Carbide (SiC) Bare Die MOSFETs & Schottky Diodes from GeneSiC deliver industry leading performance.
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SOI FET Gate Driver for Full-Bridge / H-Bridge & Motor Control applications enhances performance + reliability.
The Power MOSFET die range from Analog Power Inc. covers a broad spectrum of low & high voltage products.
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Defining SiP (System-In-Package) together with some considerations for easier design process.
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The advantages and disadvantages of using bare die to build hybrid circuits
The advantages and disadvantages of using bare die to build MCMs (Multiple-Chip-Modules)
Mechanical specification of a bare die and how a bare die can be modified to suit a specific application.
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Mechanical | SiP | MCM | Hybrid
The pros and cons of using bare die to build MCMs (Multiple-Chip-Modules)
Featured Product
EA2M
ON Semi Serial 2-Mb SPI Ultra Low-Power EEPROM with ECC for high reliability portable or battery applications.
News and Articles
High-Speed Die Processing/Sorting
Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.
