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The advantages and disadvantages of using bare die to build MCMs (Multiple-Chip-Modules)
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MCM
Mechanical specification of a bare die and how a bare die can be modified to suit a specific application.
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MCM
The pros and cons of using bare die to build MCMs (Multiple-Chip-Modules)
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MCM
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INN650N080BS
650 Volt 29 Amp 60mOhm Gallium Nitride (GaN) MOSFET. Metalized with Aluminum on topside for wirebonding.
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Senan SiC Bare Die MOSFETS
Silicon Carbide (SiC) Bare Die MOSFETs from Senan Semiconductor with best PRICE / PERFORMANCE ratio in the industry.