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Bare Die Supply

Wide range of die technologies held in nitrogen storage for fast delivery. Availability in all industry formats.

Testing at wafer and bare die level is available with standard and custom setups

Singulation of bare die is a crucial step in getting bare die from wafer into a final assembly

Transfer of singulated die from a sawn wafer is commonly known as die pick & place or plating

1200 Volt 13mOhm Silicon Carbide (SiC) MOSFET with customizable top metal back metals optimized for wire-bonding or sintering.

650 Volt 29 Amp 60mOhm Gallium Nitride (GaN) MOSFET. Metalized with Aluminum on topside for wirebonding.

Silicon Carbide (SiC) Bare Die MOSFETs from Sanan Semiconductor with best PRICE / PERFORMANCE ratio in the industry.

Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.