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News and Articles

This area lists current press releases from Die Devices together with technical articles and white papers.

Articles for tag Ceramic are listed below. Return to full list

The advantages and disadvantages of using bare die to build MCMs (Multiple-Chip-Modules)

Ceramic

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Serial 2-Mb SPI Ultra Low-Power EEPROM with ECC for high reliability portable or battery applications.

The Power MOSFET die range from Analog Power Inc. covers a broad spectrum of low & high voltage products.