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Defining SiP (System-In-Package) together with some considerations for easier design process.
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SiP
Mechanical specification of a bare die and how a bare die can be modified to suit a specific application.
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SiP
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NTC020N120SC1
ON Semi 1200 Volt 20mOhm 103A Silicon Carbide MOSFET specified at >=175°C maximum junction temperature.
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High-Speed Die Processing/Sorting
Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.