News and Articles

This area lists current press releases from Die Devices together with technical articles and white papers.

Articles for tag SiP are listed below. Return to full list

SiP Design Considerations

Defining SiP (System-In-Package) together with some considerations for easier design process.

SiP

Mechanical specification of a bare die and how a bare die can be modified to suit a specific application.

SiP

The Pros and Cons of using bare die to build SiP (System-In-Package)

SiP

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650 Volt 29 Amp 60mOhm Gallium Nitride (GaN) MOSFET. Metalized with Aluminum on topside for wirebonding.

Silicon Carbide (SiC) Bare Die MOSFETs from Senan Semiconductor with best PRICE / PERFORMANCE ratio in the industry.