Innovate > Integrate > Empower - Design at Die Level

Product Group: Memory

Our Memory IC portfolio covers a wide range of voltages, densities, interfaces and organizations. Use our range of KGD and wafer level memory to design your Chip-On-Board (COB) , System-In-Package (SiP) and Multi-Chip-Module (MCM) applications.
Please use our Parametric Search Tool or alternatively select a product sub-group from the list below:

Available Sub-Groups: