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Bare Die Supply

Wide range of die technologies held in nitrogen storage for fast delivery. Availability in all industry formats.

Testing at wafer and bare die level is available with standard and custom setups

Singulation of bare die is a crucial step in getting bare die from wafer into a final assembly

Transfer of singulated die from a sawn wafer is commonly known as die pick & place or plating

Quad High Speed Precision Difet(R) Operational Amplifier

Serial 2-Mb SPI Ultra Low-Power EEPROM with ECC for high reliability portable or battery applications.

The Power MOSFET die range from Analog Power Inc. covers a broad spectrum of low & high voltage products.

Defining SiP (System-In-Package) together with some considerations for easier design process.