Product Sub-Group: SiC MOSFET
Silicon Carbide (SiC) MOSFET bare die use wide band-gap semiconductor technology to deliver efficient power switching and with high reliability. The die material structure increases power density to yield smaller chips with reduced gate charge, reduced capacitance and low On-Resistance figures.
Please use our
Parametric Search Tool
or alternatively select a product family from the list below:
Other Sub-Groups in Transistors:
Featured Product
EA2M
ON Semi Serial 2-Mb SPI Ultra Low-Power EEPROM with ECC for high reliability portable or battery applications.
News and Articles
High-Speed Die Processing/Sorting
Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.
