- High-speed access time: 55, 70 ns
- Automatic power-down when chip is deselected
- CMOS low power operation
- 12 µW (typical) CMOS standby
- 36 mW (typical) operating
- Fully static operation: no clock or refresh required
- Three-state outputs
- Committed long term support with very low obsolescence or mask change rate.
- Density: 8M
- Memory Cell: 6T
- ECC: No
VCC (Max): 3.60V
Speed: 55,70ns
ICC (Max) @ VNOM: 30mA
ISB(CMOS): 3.0mA
ISB(TTL): 0mA
- Density: 8M
- Memory Cell: 6T
- ECC: No
VCC (Max): 3.60V
Speed: 55,70ns
ISB: 0.003mA
ISB(Max): 0.025mA
ICC: n/a
ICC (Max) @ VNOM: 35mA
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.