- Features: Daisy-Chainable
- Reference Mode: Ext
- Digital Supply: 1.65V
- Digital Supply: 2.2V
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 30.445mm² (47190mil²)
Request Pad Layout
- Bits: 24
- Channels: 8
- Interface: SPI
- Architecture: Delta-Sigma
- Input Type: Differential
- Sim Sampling: Yes
AVDD (Min): 4.75V
AVDD (Max): 5.25V
SNR: 111.00dB
INL(Max): 201.40±LSB
SR(Max): 144.000KSPS
SINAD: n/a
ADC VIN (Min): 0V
ADC VIN (Max): 5.250V
- Bits: 24Bits
- Interface: Serial SPI
- Input Channels: 8
- Architecture: Delta-Sigma
- Sim Sampling: No
AVDD (Max): 5.25V
INL(Max): 201.4±LSB
SR(Max): 144kSPS
VIN (MIN): 0V
VIN (MAX): 5.25V
PC: 530mW
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.