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Bare Die Supply

Wide range of die technologies held in nitrogen storage for fast delivery. Availability in all industry formats.

Testing at wafer and bare die level is available with standard and custom setups

Singulation of bare die is a crucial step in getting bare die from wafer into a final assembly

Transfer of singulated die from a sawn wafer is commonly known as die pick & place or plating

ON Semi 1200 Volt 20mOhm 103A Silicon Carbide MOSFET specified at >=175°C maximum junction temperature.

ON Semi Serial 2-Mb SPI Ultra Low-Power EEPROM with ECC for high reliability portable or battery applications.

Additional capacity delivers >5000UPH throughput with 24-hour operation for volume bare die sort / pick & place.

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