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Product Family: Infrared

This infrared emitter (IR) bare die range presents a wide variety of LED chips constructed for power efficiency, small size, choice of polarity & wavelength accuracy measured to 3nm. Customised diodes can also be produced for exact opto-electrical & mechanical specifications.

Please use our Parametric Search Tool or alternatively select a product from the list below:

Available Products:

EOLC-1020-17D The EOLC-1020-17D features a high accuracy peak wavelength of 1020 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1040-27D The EOLC-1040-27D features a high accuracy peak wavelength of 1040 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1060-17-1D The EOLC-1060-17-1D features a high accuracy peak wavelength of 1060 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1070-25D The EOLC-1070-25D features a high accuracy peak wavelength of 1070 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1200-27D The EOLC-1200-27D features a high accuracy peak wavelength of 1220 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1300-27D The EOLC-1300-27D features a high accuracy peak wavelength of 1270 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1460-27D The EOLC-1460-27D features a high accuracy peak wavelength of 1450 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1550-27D The EOLC-1550-27D features a high accuracy peak wavelength of 1550 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1650-25D The EOLC-1650-25D features a high accuracy peak wavelength of 1650 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-1720-17-1D The EOLC-1720-17-1D features a high accuracy peak wavelength of 1720 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-700-25D The EOLC-700-25D features a high accuracy peak wavelength of 700 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-730-25D The EOLC-730-25D features a high accuracy peak wavelength of 730 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-740-27-2D The EOLC-740-27-2D features a high accuracy peak wavelength of 740 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-760-17D The EOLC-760-17D features a high accuracy peak wavelength of 760 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-780-27D The EOLC-780-27D features a high accuracy peak wavelength of 780 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-800-25D The EOLC-800-25D features a high accuracy peak wavelength of 800 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-830-17D The EOLC-830-17D features a high accuracy peak wavelength of 830 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-850-25-1D The EOLC-850-25-1D features a high accuracy peak wavelength of 850 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-870-17-2D The EOLC-870-17-2D features a high accuracy peak wavelength of 870 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-880-25-1D The EOLC-880-25-1D features a high accuracy peak wavelength of 880 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-900-17D The EOLC-900-17D features a high accuracy peak wavelength of 900 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-950-27D The EOLC-950-27D features a high accuracy peak wavelength of 950 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-970-17D The EOLC-970-17D features a high accuracy peak wavelength of 970 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.
EOLC-980-17-1D The EOLC-980-17-1D features a high accuracy peak wavelength of 980 nm. Small bare die size combined with high quality material construction deliver maximum radiant power output. Chip interconnect is metalized with gold for high reliability.