- Features: Split Output
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 1.065mm² (1650mil²)
Request Pad Layout
- Channels: 1
- Switch Type: MOSFET, IGBT, SiCFET
- Ch I/P Logic: Non-Inverting, Single
- Input Threshold: CMOS, TTL
VCC (Max): 32V
IO (PEAK): 5.0A
tpd: 17ns
tf: 7ns
V- @ HS Pin: -5V
tr: 15ns
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.