- LCD Driver:
- 96SEG × 1–16COM (max.)
- 88SEG × 17–24COM (max.)
- 80SEG × 25–32COM (max.)
- 384kB Flash, 32kB RAM
- x4 channel DMA controller
- x4 clock generation sources
- x73 GPIO
- x8 16-Bit Timers, Watchdog Timer, x2 16-Bit PWM Timers & RTC
- Supply-Voltage detector
- Multiple serial interfaces: x2 UART, x2 SPIA, x1 QSPI, x2 I2C
- USB 2.0 FS controller
- Sound generator
- IR remote controller
- 12-Bit SAR ADC
- Temperature Sensor / Reference Voltage generator
- R/F Converter
- Multiple reset & interrupt protocols
- 105°C temperature operation
- Very small form factor capable of ultra-thin height profile
Power Consumption:
- SLEEP Mode: 0.7µA
- HALT Mode: 2µA
- RUN Mode: 150µA/MHz (Mode 1), 214µA/MHz (Mode 0)
Applications:
- Low power & high integration display systems
- Battery driven controllers
- Wearable products
- Remote Sensors
- MCM, MCP and SiP integration
Epson
Electrical Datasheet
Die Physical Data:
Footprint: 22.420mm² (34751.457mil²)
Request Pad Layout
- ARM CPU: Cortex®-M0+
- TMR 16-bit: 8
- TMR 32-bit: n/a
- OPA: n/a
- CMP: n/a
- AES: No
- USART: n/a
- UART: 2
- GPIO: 73
- I2C: 2
- USB: 1
f(MAX): 33MHz
Flash: 384kB
RAM: 32kB
ADC: 12Bit
DAC: -Bit
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.