- Additional Features: Watchdog, Temp Sensor, Brown Out Reset
- Multiplier: N/A
- Special I/O: N/A
- BSL: UART
- USCI_A(UART/LIN/IrDA/SPI): 1
- USCI_B(I2C & SPI): 1
- Flash: 4KB
- AES: N/A
- CPU: MSP430
- ADC Channels: 8
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 8.981mm² (13920mil²)
Request Pad Layout
- I2C: 2
- SPI: 4
- UART: 2
- DMA: -Ch
- Comp Inputs: 2
- TMR 16-bit: 2
- TMR 32-bit: 1
- GPIO: 24
NVM: 4KB
RAM: -KB
VCC (Min): 1.8V
VCC (Max): 3.6V
Active Power: 250µA/MHz
S/B Pwr (LPM/HALT): 0.7µA
Sleep Pwr: n/a
Wake Time: 1.0µs
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.