This bare die is well suited for integration into high density MCP (Multi-Chip-Package), MCM (Multi-Chip-Module) & SiP (System-In-Package) solutions. Supported by the highest quality KGD test flow, wafers deliver high reliability and superior yield.
Features:
- Internal self-timed write cycle
- Individual Byte Write Control and Global Write
- Clock controlled, registered address, data and control
- Burst sequence control using MODE input
- Three chip enable option for simple depth expansion and address pipelining
- Common data inputs and data outputs
- Auto Power-down during deselect
- Single cycle deselect
- Snooze MODE for reduced-power standby
- Committed long term support with very low obsolescence or mask change rate.
Product Families: Used for this device are tabulated below.
Functional:
- Density: 36M
Specification:
Organisation: VDD: 3.3V
VDDQ: 2.5/3.3V
Speed: 250,200,166MHz
tKQ:
VDDQ: 2.5/3.3V
Speed: 250,200,166MHz
tKQ:
Other Detail: Important information for this device is tabulated below.
Traffic light setting for Minimum Order Quantity indicates the following:
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
Traffic light setting for High Reliability indicates the following:
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
Traffic light setting for Space Grade indicates the following:
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.
