- Very small form factor capable of ultra thin height profile
- High temperature capability with no package limitation
- Single-supply operation down to 2.5V
- Low-power CMOS technology
- 1mA active current typical
- 1µA standby current typical (I-temp)
- Organized as 1 block of 128 bytes (1 x 128 x 8)
- 2-wire serial interface bus, I2C™ compatible
- Schmitt Trigger inputs for noise suppression
- Output slope control to eliminate ground bounce
- Self-timed write cycle (including auto-erase)
- Page write buffer for up to 8 bytes
- 2 ms typical write cycle time for page write
- Hardware write-protect for entire memory
- Can be operated as a serial ROM
- Factory programming (QTP) available
- ESD protection > 4,000V
- 1,000,000 erase/write cycles
- Data retention > 200 years
Applications:
- MCMs
- SiP integration
Microchip
Electrical Datasheet
Die Physical Data:
Footprint: 0.946mm² (1466.819mil²)
Request Pad Layout
- Features: Schmitt Trigger
- ECC: No
Organisation: VCC (Min): 2.50V
VCC (Max): 5.50V
fcycle(MAX): 400kHz
ISB: 1µA
IS(ACTIVE): 1.0mA
Page size: 8Bytes
Endurance: 1,000,000cycles
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.