- High-speed access time: 25, 35 ns
- Automatic power-down when chip is deselected
- CMOS low power operation
- 0.6 mW (typical) CMOS standby
- 35 mW (typical) operating
- Fully static operation: no clock or refresh required
- Three-state outputs
- Committed long term support with very low obsolescence or mask change rate.
- Density: 4M
- Memory Cell: 6T
- ECC: No
VCC (Max): 3.60V
Speed: 25,35ns
ISB: 0.200mA
ISB(Max): 2.000mA
ICC: 11mA
ICC (Max) @ VNOM: 25mA
- Density: 4M
- Memory Cell: 6T
- ECC: No
VCC (Max): 3.60V
Speed: 25,35ns
ICC (Max) @ VNOM: 50mA
ISB(CMOS): 0.2mA
ISB(TTL): 7mA
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.