- Transient Protection for Data Lines:
- IEC 61000-4-2 (ESD) ±15kV (Air), ±15kV (Contact)
- IEC 61000-4-4 (EFT) 40A (tP=5/50ns).
- Configurable as x2 unidirectional channels or x1 bidirectional channel
- Very low leakage:
- 1nA Maximum at 25°C (measured in low light conditions)
- 10nA Typical at 125°C.
- Low diode capacitance
- 5V stand-off voltage
- Simple bondout for bidirectional line protection
- Very small form factor capable of ultra-thin height profile.
Applications:
- Data line protection
- Small-size high integration portable electronics
- MCM, MCP and SiP integrations.
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 0.101mm² (157.325mil²)
Request Pad Layout
- Channels: 2
- Bi-/Uni-Directional: x1 Bi / x2 Uni
- Interface: -
VC: 9.7V
ILEAK (io): 2nA
rD: 0.6Ω
Cio: 25.0pF
IEC 61000-4-2 Air-Gap: 30±kV
IEC 61000-4-2 Contact: 30±kV
- Channel: x1 Bi / x2 Uni
VBR (Min): 6.5V
VBR (Max): 8.50V
IT: 5mA
VC: 9.7V
IPP: 11.00A
IR(MAX) @ VR 25°C: 2.0nA
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.