- Very low reverse recovery time
- Low switching losses
- Soft, non-snap off recovery characteristics
- Very low forward voltage drop
- Low leakage
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 1.032mm² (1600mil²)
Request Pad Layout
- N/A
IO: 2.5A
IFSM: 35A
VF @ IF: 0.875V
IF @ VF: 1.0A
VF @ IF2: 0.975V
IF2 @ VF: 2.5A
IR 25°C: 1µA
IR @ VR: 150V
trr 25°C: 25ns
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.