- Very small form factor
- High temperature capability with no package limitation
- Ultra-fast recovery time
- Low capacitance
- Low reverse leakage current
- Characterised at military temperature
- Low forward voltage drop
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 0.122mm² (189.874mil²)
Request Pad Layout
- N/A
IF: 300mA
IFSM: 2.8A
IR(MAX) @ VR 25°C: 0.50µA
IR @ VR: 75V
IR(MAX) @ VR Thigh: 100µA
VF @ IF: 0.800V
IF @ VF: 10mA
VF @ IF2: 1.20V
IF2 @ VF: 100mA
trr 25°C: 4ns
CT(Max): 4pF
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.