- Soft reverse recovery at low and high temperature
- Very low forward voltage drop
- Low leakage current for high efficiency
- High Surge Capacity
- Guard Ring for Enhanced Durability and Long Term Reliability
Applications:
- Polarity Protection
- Free-Wheeling
- Converters
- Switching Power Supplies
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 12.613mm² (19550.021mil²)
Request Pad Layout
- Assembly: Solder
- TJ(MAX): 175°C
IF: 20A
IFSM: 396A
VF @ IF: 0.68V
VF @ IF 125°C: 0.62V
IR(MAX) @ VR 25°C: 0.60mA
IR(MAX) @ VR Thigh: 45.0mA
CT(Max): 1,200pF
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.