- VCC: 3.3V
- Features: 3.3V Vcc/Vdd, Integrated EEPROM, Multiplier/Divider
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 17.778mm² (27556mil²)
Request Pad Layout
- I/P Level: LVPECL, LVCMOS
- O/P Level: LVPECL
- Outputs: 10
- Divider Ratio: 1 to 80
VS (Max): 3.60V
Frequency (MAX): n/a
fMAX (OUT): 1,500MHz
- I/P Level: LVPECL, LVCMOS
- O/P Level: LVPECL
- Outputs: 10
- Divider Ratio: 1 to 80
VS (Max): 3.60V
fMAX (OUT): 1,500MHz
- I/P Level: LVPECL, LVCMOS
- O/P Level: LVPECL
- Outputs: 10
- Divider Ratio: 1 to 80
VS (Max): 3.60V
Frequency (MAX): n/a
fMAX (OUT): 1,500MHz
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.