- TCR tracking between halves (RA/RB) (1): ± 2 ppm/°C
- Center-tap ratio, RA/RB: Tolerance: 1% ± 1% standard
- Noise, MIL-STD-202\TM308: -20dB
- Moisture resistance, MIL-STD-202\TM106: ± 0.5% max.△R/R
- Stability , 1000 h, +125°C, 125 mW: ± 0.2% max. absolute
- Operating temperature range: -55°C to +150°C
- Thermal shock, MIL-STD-202\TM107F: 0.1% max.△R/R
- High temperature exposure, +150°C, 100h: ± 0.2% max.△R/R
- Dielectric voltage breakdown: 200V
- Insulation resistance: 1012Ω min
- Operating voltage: 100V max
- DC power rating at +70°C (derated to zero at +175°C): 0.25W
- 5x rated power short-time overload, +25°C, 5s: ± 0.1% max. △R/R (1) 5 ppm/°C for R< 100. 20 ppm/°C for R< 20
Vishay
Electrical Datasheet
Die Physical Data:
Footprint: 0.581mm² (900.001mil²)
Request Pad Layout
- Pad Metal: Au
- Back Metal: Au
- Supply Format: Waffle Pack
Tolerance: 0.05%
Ratio Tol.: 0.1%
Temp. Coefficient: ±50ppm/°C
TC Track: 5±ppm/°C
Visual Grade:
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.