- Solderable/sinterable front metal for rugged interconnect
- Die thickness: 70µm for optimal VCE(Sat)
- Easy paralleling due to positive temperature coefficient of on-state voltage
- Short circuit rated for 10µs
- Very low gate charge
- Square RBSOA @ 2x IC
- Low EMI
- 175°C junction temperature capability.
Littlefuse (IXYS)
Electrical Datasheet
Die Physical Data:
Footprint: 150.520mm² (233306.719mil²)
Request Pad Layout
- Status: Active
- Technology: XPT Trench
- TJ(MAX): 175°C
- Short Circuit Rated: Yes
- Integral Gate Resistor: No
- Top Metal: Solderable
IC(Max): 300A
VCEsat(Max): 1.70V
VGEth(Min): 5.0V
VGEth(Max): 6.5V
tr: 45ns
tf: 40ns
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.