- 650V Trench & Field Stop technology
- High speed switching series third generation
- Low VCEsat
- Low EMI
- Low turn-off losses
- Positive temperature coefficient
Applications:
- Welding, UPS, Converters with high switching frequency, Motor & Control Drives
Infineon
Electrical Datasheet
Die Physical Data:
Footprint: 10.240mm² (15871.894mil²)
Request Pad Layout
- Status: Active
- Technology: FS Trench
- TJ(MAX): 175°C
- Short Circuit Rated: No
- Integral Gate Resistor: No
- Top Metal: Bondable
IC(Max): 20A
VCEsat(Max): 2.32V
VGEth(Min): 4.2V
VGEth(Max): 5.6V
tr: n/a
tf: n/a
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.