- Diodes Inc
Diodes Inc
Electrical Datasheet
Die Physical Data:
Footprint: 1.678mm² (2601.003mil²)
Request Pad Layout
- N/A
IC(Max): 5.000A
hFE1(Min): 300
hFE1(Max): n/a
hFE1 @ IC: 1,000mA
hFE2(Min): 200
hFE2 @ IC: 5,000.00mA
VCE(sat)1(Max): 0.040V
VCE(sat)1 IC/IB: 0.5/10A/mA
VCE(sat)2(Max): 0.35V
VCE(sat)2 IC/IB: 5/25A/mA
fT(Min): 150MHz
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.