- IO Supply: 1.8, 3.3V
- General Purpose Memory: 1 16-bit GPMC, 1 32-bit (SDRC, Async SRAM, NAND flash, NOR flash, OneNAND flash)
- On-Chip L1 Cache: 32 KB (ARM Cortex-A8)
- On-Chip L2 Cache: 256 KB (ARM Cortex-A8)
- Other On-Chip Memory: 64 KB
- McBSP: 5
- MMC/SD: 3
- Video Port (Configurable): 1 Input, 1 Output
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 55.139mm² (85466mil²)
Request Pad Layout
- I2C: 1
- SPI: 2
- ARM CPU: 1 ARM Cortex-A8
- Crypto HW Acc: Yes
- Display Options: DSS
- DMA: 32 Ch SDMACh
- DRAM: LPDDR1, DDR2
- EMAC: 10/100
- Operating Systems: Neutrino, Integrity, Windows Embedded CE, Linux, VXWorks, Android
- UART (SCI): 2
- USB: 2
ARM MIPS(Max): CAN: 1
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.