- Processor Name: TI-OMAP-L1xx, TI TMS320C6742/6/8
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 14.219mm² (22040mil²)
Request Pad Layout
- LDOs: 2
- Regulated Outputs: 5
- Step-Down DC/DC Controller: 0
- Step-Down DC/DC Converter: 3
- Step-Down DC/DC Controller: 0
- Step-Down DC/DC Converter: 0
IQ: 0.080mA
VIN (MIN): 2.8V
VIN (MAX): 6.3V
ISD: 0.08µA
VOUT (MAX): 3.3V
IOUT (MAX): 2A
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.