- Features: Frequency Synchronization
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 6.775mm² (10502mil²)
Request Pad Layout
- Topology: Buck-Boost
Frequency (MAX): 1kHz
IQ: 2.50mA
VIN (MIN): 3.5V
VIN (MAX): 15.0V
VOUT (MAX): -5.0V
VOUT (MIN): -5.0V
IOUT (MAX): 0.10A
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.