- Integrated Memory-Display-Controller
- 256kB Flash, 96kB RAM
- x4 channel DMA controller
- x4 clock generation sources
- x57 GPIO
- x8 16-Bit Timers, Watchdog Timer, x2 16-Bit PWM Timers & RTC
- Supply-Voltage detector
- Multiple serial interfaces: UART, SPIA, QSPI, I2C
- USB 2.0 FS controller
- Sound generator
- IR remote controller
- 12-Bit SAR ADC
- Temperature Sensor / Reference Voltage generator
- Multiple reset & interrupt protocols
- Very small form factor capable of ultra-thin height profile
Power Consumption:
- SLEEP Mode: 0.46µA
- HALT Mode: 1.7µA
- RUN Mode: 155µA/MHz (Mode 1), 250µA/MHz (Mode 0)
Applications:
- Low power & high integration systems
- Battery-driven controllers
- Wearable products
- Remote Sensors
- MCM, MCP and SiP integrations
Epson
Electrical Datasheet
Die Physical Data:
Footprint: 19.802mm² (30693.969mil²)
Request Pad Layout
- ARM CPU: Cortex®-M0+
- TMR 16-bit: 8
- TMR 32-bit: n/a
- OPA: n/a
- CMP: n/a
- AES: No
- USART: n/a
- UART: 3
- GPIO: 57
- I2C: 2
- USB: 1
f(MAX): 21MHz
Flash: 256kB
RAM: 96kB
ADC: 12Bit
DAC: -Bit
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.