Bare Die Product Detail: MSP430FR5739

Embedded FRAM MCU:
MSP430FR573x,MSP430FR572x Mixed Signal Microcontroller

Features:

Additional Features: Real-Time Clock, Watchdog, Temp Sensor, Brown Out
Multiplier: 32x32
BSL: UART
AES: N/A
Special I/O: N/A
USCI_A(UART/LIN/IrDA/SPI): 2
USCI_B(I2C & SPI): 1
ADC Channels: 14
CPU: MSP430

Vendor:
Texas Instruments
Electrical Datasheet

Die Physical Data:
Footprint: 4.761mm² (7380mil²)
Request Pad Layout

Product Families: Used for this device are tabulated below.

Embedded FRAM MCU

Functional:

GPIO: 32
I2C: 1
SPI: 1
TMR 16-bit: 1
UART: 1
Comp Inputs: 1
DMA: 3Ch
TMR 32-bit: 1

Specification:

V_{CC (Min)}: 2.0V
V_{CC (Max)}: 3.6V
f_(MAX): 24MHz
NV Memory: 16KB
ADC: RAM: 1KB
Active Power: 91.667µA/MHz
FRAM: 4KB
S/B Pwr (LPM/HALT): 6.4µA
Wake Time: 78µs

Other Detail: Important information for this device is tabulated below.

Traffic light setting for Minimum Order Quantity indicates the following:

Green:Available from stock or at low factory MOQ.
Amber: Available on factory order with MOQ.
Red: High factory MOQ may apply, please ask for details.

Traffic light setting for High Reliability indicates the following:

Green: This bare die is specified and tested for use in high reliability applications.
Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
Red: This bare die is not specified or specifically designed for use in high reliability applications.

Traffic light setting for Space Grade indicates the following:

Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.