This bare die is well suited for integration into high density MCP (Multi-Chip-Package), MCM (Multi-Chip-Module) & SiP (System-In-Package) solutions. Supported by the highest quality KGD test flow, wafers deliver high reliability and superior yield.
Features:
- High-speed, low pin count
- Industry Standard Serial Interface
- Low Power with Wide Temperature Range
- Flexible & Efficient Memory Architecture
- Read-While-Write (RWW) support available
- Committed long term support with very low obsolescence or mask change rate.
Product Families: Used for this device are tabulated below.
Functional:
- Density: 256Mb
- Type: xSPI
Specification:
Op Voltage: 1.7-2.0V
Freq: 200MHz
Temp Range: -40 to 125°C
Freq: 200MHz
Temp Range: -40 to 125°C
Other Detail: Important information for this device is tabulated below.
Traffic light setting for Minimum Order Quantity indicates the following:
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
Traffic light setting for High Reliability indicates the following:
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
Traffic light setting for Space Grade indicates the following:
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.
