This bare die is well suited for integration into high density MCP (Multi-Chip-Package), MCM (Multi-Chip-Module) & SiP (System-In-Package) solutions. Supported by the highest quality KGD test flow, wafers deliver high reliability and superior yield.
Features:
- High Performance, high Reliability
- 1 bit of data per memory cell with fast read and write capabilities
- Automatic read operations
- Hardware data protection
- Automatic read operations
- Up to 100K Program/Erase Cycles
- 10-year Data Retention
- Supports 1-, 4-, and 8-bit ECC per 512Byte
- Committed long term support with very low obsolescence or mask change rate.
Product Families: Used for this device are tabulated below.
Functional:
- Density: 2Gb
- ECC: 4-bit
Specification:
Op Voltage: 1.8V
Width: Speed: 45ns
Temp Range: -40 to 105°C
Width: Speed: 45ns
Temp Range: -40 to 105°C
Other Detail: Important information for this device is tabulated below.
Traffic light setting for Minimum Order Quantity indicates the following:
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
Traffic light setting for High Reliability indicates the following:
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
Traffic light setting for Space Grade indicates the following:
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.
