- Low-voltage Core and I/O Power Supplies VDD2 = 1.14-1.30V, VDDCA/VDDQ = 1.14-1.30V, VDD1 = 1.70-1.95V
- High Speed Un terminated Logic(HSUL_12) I/O Interface
- Clock Frequency Range : 10MHz to 533MHz (data rate range : 20Mbps to 1066Mbps per I/O)
- Four-bit Pre-fetch DDR Architecture
- Multiplexed, double data rate, command/address inputs
- Eight internal banks for concurrent operation
- Bidirectional/differential data strobe per byte of data (DQS/DQS#)
- Programmable Read/Write latencies(RL/WL) and burst lengths(4,8 or 16)
- ZQ Calibration
- On-chip temperature sensor to control self refresh rate
- Partial –array self refresh(PASR)
- Deep power-down mode(DPD)
- Operation Temperature -40°C to 105°C
- Committed long term support with very low obsolescence or mask change rate.
- Density: 4.2Gb
Width: VS: 1.2V
Refresh: 8K
Speed: 533, 400, 333MHz
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.