- Configuration:
- 128Mb x16 x 1 channel.
- 8 internal banks per channel
- Low-voltage Core and I/O Power Supplies:
- VDD1 = 1.70-1.95V
- VDD2 = 1.06-1.17V
- VDDQ = 1.06-1.17V (LPDDR4)
- VDDQ = 0.57-0.65V (LPDDR4X)
- LVSTL(Low Voltage Swing Terminated Logic) I/O Interface
- Internal VREF and VREF Training
- Dynamic ODT :
- DQ ODT :VSSQ Termination
- CA ODT :VSS Termination
- 16n Pre fetch DDR architecture
- Single data rate (multiple cycles) command/address bus
- Bidirectional/differential data strobe per byte of data (DQS/DQS#)
- Programmable burst lengths (16 or 32)
- Operation Temperature -40°C to 105°C
- Committed long term support with very low obsolescence or mask change rate.
- Density: 2Gb
Width: VS: 0.6V
Refresh: 8K
Speed: 3733Mbps
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.