- Family: TS
- ron (Max): 6Ω
- Switch Configuration: 1:2
- Features: USB 2.0, Logic Controlled (Output Enabled)
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 0.836mm² (1296mil²)
Request Pad Layout
- Channels: 2
- Switch Type: SPDT
VCC (Max): 3.60V
ICC (Max): 30.00µA
BW (Max): 900MHz
ICC (Max) @ VNOM: n/a
RON: 3.00Ω
IO (CONT): n/a
- Channels: 2
- Function: 1:2 SPDT
VS (Max): 3.60V
Bandwidth: 900MHz
ICC (Max) @ VNOM: 0.03mA
RON: 3Ω
tpd (Max) @ VNOM: 0.25ns
VIN (MIN): 0.00V
VIN (MAX): 5.50V
ESD HBM: 7kV
ICEX: 1µA
- Channels: 2
- Config: 2:1 SPDT
VCC (Max): 3.60V
BW (Max): 900MHz
ICC (Max) @ VNOM: 30.00µA
RON (Max): 6.0Ω
RON: 3.00Ω
VIO (Min): 0.00V
VIO (Max): 5.50V
IIO (Cont): 120mA
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.