N/A
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 2.129mm² (3300mil²)
Request Pad Layout
- Channels: 1
- I/P Level: AC-Coupled
- O/P Level: AC-Coupled
- Protocols: 10G-SR/LR, FibreChannel
VS: 3.30V
Datarate: 11.3Gbps
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.