N/A
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 1.486mm² (2304mil²)
Request Pad Layout
- I/P Level: Single-Ended
- O/P Level: LVPECL
- Function: Buffer
Datarate: 4,000Mbps
ESD HBM: 3kV
Tx: 1Rx: 1
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.