These bare die are metalized with Aluminium top side for wirebonding and Silver back side for solder attach for use in high integration and high reliability applications.
Features:
- Excellent clamping capability
- 600W peak pulse power capability at 10/1000µs waveform
- IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
- Low Reverse Leakage
- Epitaxial Fab Process
- Aluminum top metal for wirebonding
- Silver back metal for soldering
- High Reliability tested grades
- Long term availablity
Vendor:
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 2.993mm² (4639.009mil²)
Request Pad Layout
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 2.993mm² (4639.009mil²)
Request Pad Layout
Product Families: Used for this device are tabulated below.
Functional:
- Direction: Uni-Directional
Specification:
VRRM: 22.00V
VBR (Min): 24.4V
VBR (Max): 26.87V
IT: 1mA
VC: 36V
IPP: 16.90A
IR @ VR: 0.8µA
VBR (Min): 24.4V
VBR (Max): 26.87V
IT: 1mA
VC: 36V
IPP: 16.90A
IR @ VR: 0.8µA
Other Detail: Important information for this device is tabulated below.
Traffic light setting for Minimum Order Quantity indicates the following:
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
Traffic light setting for High Reliability indicates the following:
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
Traffic light setting for Space Grade indicates the following:
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.
