- 200W peak pulse power capability at 10/1000µs waveform
- Aluminum top metal for wirebonding
- Silver back metal for soldering
- High Reliability tested grades
- Smaller die size for space constrained applications
- Long term availablity
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 0.931mm² (1443.403mil²)
Request Pad Layout
- Direction: Uni-Directional
VBR (Min): 6.70V
VBR (Max): 7.34V
IT: 10mA
VC: 10.3V
IPP: 19.4A
IR @ VR: 1.00µA
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.