- High breakdown voltage: 100V minimum
- High current capability: 500mA
- Low forward voltage profile:
- 0.45V (Typ) @ 10mA
- 0.59V (Typ) @ 100mA
- 0.70V (Typ) @ 250mA
- 0.79V (Typ) @ 500mA
- Very small form factor
- Guardring for over-voltage protection and high reliability
- High temperature capability with no package limitation
Silicon Supplies
Electrical Datasheet
Die Physical Data:
Footprint: 0.341mm² (528.638mil²)
Request Pad Layout
- TJ(MAX): 150°C
IF: 500mA
IFSM: 5,500mA
VF @ IF: 0.450V
IF @ VF: 10mA
VF @ IF 125°C: 0.310V
IR(MAX) @ VR 25°C: 0.10µA
IR @ VR: 100V
IR(MAX) @ VR Thigh: 40.0µA
CT(Max): 21.0pF
trr 25°C: n/a
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.