- Die thickness: 265µm
- Glass passivated
- VF: 2.63V @ IF = 150A, TJ = 150°C
- IR: 11µA, TJ = 125°C
- IRM: 200A @ IF = 250A, di/dt = 2500A/µs
- trr: 150ns @ IF = 250A, di/dt = 2500A/µs
Littlefuse (IXYS)
Electrical Datasheet
Die Physical Data:
Footprint: 153.760mm² (238328.734mil²)
Request Pad Layout
- Status: Active
- TJ(MAX): 150
- Top Metal: Bondable
IF: 150A
IFSM: 1,600A
VF @ IF: 2.63V
trr 25°C: 150ns
IR 25°C: 550µA
IRM 25°C: 200.0A
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.