- General Purpose Memory: EMIF
- Other Hardware Acceleration: dMAX (Dual Data Movement Acc)
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 23.979mm² (37168mil²)
Request Pad Layout
- DMA: -Ch
- DSP: 1 C67x
- DSP Instruction: Floating Point
- McASP: 2
- McBSP: 1
- Operating Systems: DSP/BIOS
DSP MHz(Max): HPI: L1 Cache: 128KB
L2 Cache: 512KB
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.