- Applications: Communications and Telecom
- IO Supply: 1.8 V, 3.3 VV
- HPI: 1 16-bit
- eCAP: 3
- LCD: 1
- McASP: 3
- MMC/SD: 1
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 26.493mm² (41064mil²)
Request Pad Layout
- I2C: 1
- SPI: 1
- Display Options: 1
- DMA: 32-Ch EDMACh
- DRAM: SDRAM
- DSP: 1 C674x
- EMAC: 10/100
- Operating Systems: DSP/BIOS
- PWM: 1Ch
- SATA: 1
- UART (SCI): 1
- USB: 1
L2 Cache: 256KB
Other On-Chip Memory: 1KB
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.