- Applications: Audio, Consumer Electronics, Energy, Industrial, Security, Video and Imaging
- IO Supply: 1.8, 3.3V
- General Purpose Memory: Async SRAM, GPMC, NAND Flash, NOR Flash, OneNAND, SmartMedia/xD
- On-Chip L1 Cache: 32 KB (ARM9)
- ARM MIPS(Max): 270
- PWM: 4
- DAC: 3
- HPI: 1
- McBSP: 1
- MMC/SD: 2
- TI Audio Codecs: AAC-LC, G.711, MP3, WMA
- TI Video Codecs: H.264-BP, JPEG, MPEG4-SP
- Video Capability: Encode, Decode, Image Enhance
- Trace Enabled: Yes
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 39.308mm² (60928mil²)
Request Pad Layout
- I2C: 1
- SPI: 1
- ARM CPU: 1 ARM9
- DMA: YesCh
- DRAM: 1 16-bit (LPDDR-336, DDR2-680)
- DSP: -
- DSP Instruction: -
- EMAC: 10/100
- Operating Systems: Neutrino, PrOS, Integrity, Windows Embedded CE, Linux
- PCI/PCIe: 1
- UART (SCI): 1
- USB: 1
- Video Acceleration: 1 MJCP, 1 HDVICP
- Video Port (Configurable): 1 Input, 1 Output
- Video Res / FR rate: D1 or Less, 720p
DSP MHz(Max): -MHz
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.