Bare Die Product Detail: OMAPL137-HT

Fixed & Floating Point DSP + ARM9™:
High Temperature Low Power Applications Processor

Features:

Applications: Communications and Telecom, Consumer Electronics, Energy, Industrial, Medical
IO Supply: 1.8,3.3V
General Purpose Memory: 1 32-bit (SRAM, NAND Flash, NOR Flash)
On-Chip L1 Cache: 64 KB (DSP)
On-Chip L2 Cache: 256 KB (DSP)
Other On-Chip Memory: 128 KB (L3)
PWM: 3
DMA: 64-Ch EDMA
eCAP: 3
HPI: 1 16-bit
McASP: 3
MMC/SD: 1
Typical Power: 600-1500mW
Standby Power: 36 mW
TI Audio Codecs: AAC,MP3,WMA,G.711,G.722,G.726
ARM MIPS(Max): 300

Vendor:
Texas Instruments
Electrical Datasheet

Die Physical Data:
Footprint: 26.493mm² (41064mil²)
Request Pad Layout

Product Families: Used for this device are tabulated below.

Functional:

Specification:

ARM MHz_(Max): 300MHz
DSP MHz_(Max): 300MHz

Other Detail: Important information for this device is tabulated below.

Traffic light setting for Minimum Order Quantity indicates the following:

Traffic light setting for High Reliability indicates the following:

Green: This bare die is specified and tested for use in high reliability applications.
Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
Red: This bare die is not specified or specifically designed for use in high reliability applications.

Traffic light setting for Space Grade indicates the following:

Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.