- Applications: Communications and Telecom, Consumer Electronics, Energy, Industrial, Medical
- IO Supply: 1.8, 3.3V
- General Purpose Memory: 1 32-bit (SRAM, NAND Flash, NOR Flash)
- On-Chip L1 Cache: 64 KB (DSP)
- On-Chip L2 Cache: 256 KB (DSP)
- Other On-Chip Memory: 128 KB (L3)
- PWM: 3
- DMA: 64-Ch EDMA
- eCAP: 3
- HPI: 1 16-bit
- McASP: 3
- MMC/SD: 1
- Typical Power: 351-1000mW
- Standby Power: 63 mW
- TI Audio Codecs: AAC, MP3, WMA, G.711, G.722, G.726
- ARM MIPS(Max): 456
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 26.493mm² (41064mil²)
Request Pad Layout
- I2C: 1
- SPI: 1
- ARM CPU: 1 ARM9
- DRAM: SDRAM
- DSP: 1 C674x
- DSP Instruction: Fixed and Floating Point
- EMAC: 10/100
- Operating Systems: DSP/BIOS, Linux, Windows Embedded CE
- SATA: 1
- UART (SCI): 1
- USB: 1
- Video Port (Configurable): 1 Output
DSP MHz(Max): 456MHz
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.