- Applications: Audio, Automotive, Communications and Telecom, Consumer Electronics, Industrial
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 35.710mm² (55350mil²)
Request Pad Layout
- ADC Channels: 0
- I2C: 1
- SPI: 1
- DMA: 6Ch
- DRAM: SDRAM
- DSP: 1 C55x
- DSP Instruction: Fixed Point
- McBSP: 2
- Operating Systems: DSP/BIOS, VLX
- UART (SCI): 1
- USB: 1
DSP MHz(Max): Gen Purpose Memory: 1 32-bit (Async SRAM,SBSRAM)MHz
HPI: L1 Cache: 24 KB (DSP)KB
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.