Features:
- Applications: Audio, Automotive, Communications and Telecom, Consumer Electronics, Industrial
Vendor:
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 18.043mm² (27966mil²)
Request Pad Layout
Texas Instruments
Electrical Datasheet
Die Physical Data:
Footprint: 18.043mm² (27966mil²)
Request Pad Layout
Product Families: Used for this device are tabulated below.
Functional:
- ADC Channels: 0
- I2C: 2
- SPI: 1
- DMA: 6Ch
- DRAM: SDRAM
- DSP: 1 C55x
- DSP Instruction: Fixed Point
- McBSP: 2
- Operating Systems: DSP/BIOS, VLX
- UART (SCI): 2
- USB: 1
Specification:
VS (IO): 3.3V
DSP MHz(Max): Gen Purpose Memory: 1 32-bit(Async SRAM,SBSRAM)MHz
HPI: L1 Cache: 16 KB (DSP)KB
DSP MHz(Max): Gen Purpose Memory: 1 32-bit(Async SRAM,SBSRAM)MHz
HPI: L1 Cache: 16 KB (DSP)KB
Other Detail: Important information for this device is tabulated below.
Traffic light setting for Minimum Order Quantity indicates the following:
- Green:Available from stock or at low factory MOQ.
- Amber: Available on factory order with MOQ.
- Red: High factory MOQ may apply, please ask for details.
Traffic light setting for High Reliability indicates the following:
- Green: This bare die is specified and tested for use in high reliability applications.
- Amber: This bare die can meet higher reliability specifications with additional testing & qualification, please ask for details.
- Red: This bare die is not specified or specifically designed for use in high reliability applications.
Traffic light setting for Space Grade indicates the following:
- Green: This bare die is qualified for space applications or has space level qualification data, please ask for details.
- Amber: This bare die can be specified for space applications with additional testing and qualification, please ask for details.
- Red: Suitability of this bare die for space applications is unknown and requires further qualification, please ask for details.
